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IR2277S/IR2177S (PbF)
3
PCB LAYOUT TIPS
3.3 Antenna loops and inputs
connection
3.1 Distance from H to L voltage
The IR2277S/IR2177S package (wide body)
maximizes the distance between floating (from DC-
to DC+) and low voltage pins (V SS ). It is strongly
recommended to place components tied to floating
voltage in the respective high voltage portions of the
device (V B , V S ) side.
3.2 Ground plane
Ground plane must NOT be placed under or nearby
the high voltage floating side to minimize noise
coupling.
VB
Current loops behave like antennas able to receive
EM noise. In order to reduce EM coupling loops
must be reduced as much as possible. Figure 21
shows the high side shunt loops.
Moreover it is strongly suggested to use Kelvin
connections for V in+ and V in- to shunt paths and star-
connect V S to V in- close to the shunt resistor as
explained in Fig. 22.
VB
VS
V in -
V in +
VS
Antenna
Vin-
Loop
Vin+
Figure 22: Recommended shunt connection
19
Figure 21: antenna loops
3.4 Supply capacitors
The supply capacitors must be placed as close as
possible to the device pins (V CC and V SS for the
ground tied supply, V B and V S for the floating
supply) in order to minimize parasitic traces
inductance/resistance
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